Official Course Description: MCCCD Approval: 03/22/94
GTC104 19946-99999 L+L 4 Credit(s) 7 Period(s)
Manufacturing Processes
Introduces students to manufacturing processes used in conversion of raw materials into useful products. Presents the basic manufacturing processes in logical groups, based on similarities of purpose and applications. Prerequisites: None.
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MCCCD Official Course Competencies:
 
GTC104   19946-99999 Manufacturing Processes
1. Apply safety habits and identify shop hazards and unsafe practices. (I)
2. Identify and describe the properties and applications of basic groups of raw materials, and perform simple casting operations. (II)
3. Identify and describe the forming processes as they relate to the shaping of materials, perform simple sheet metal layout, and operate related equipment. (III)
4. Identify and describe the separation processes as they relate to chip and chipless material removal, and operate basic machine shop equipment, including saws, grinders, lathe, mill, and drills. (IV)
5. Identify and describe the joining and assembling processes including welding, adhesives, and mechanical fasteners. (V)
6. Perform basic operations in Oxyacetylene welding, brazing, soldering/electrical soldering. (V)
7. Identify and describe conditioning processes and surface preparation processes including heat treating. (VI)
8. Apply electronics fabrication techniques including soldering, desoldering, wire wrapping, printed circuit board etching, and variousassembly techniques. (VII)
9. Identify electronics components and fundamental subsystems. (VIII)
10. Draw per industry standards, electronics symbols, schematics, and electromechanical layouts. (VIII)
11. Perform precision measurements using micrometers, verrier calipers, and dial indicators. (IX)
12. Participate in team building and self direction as it relates to total quality management. (IX)
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MCCCD Official Course Outline:
 
GTC104   19946-99999 Manufacturing Processes
    I. Safety
        A. Safety practices
        B. Shop orientation
        C. Safety films
      II. Raw Materials
          A. Ferrous
          B. Non-ferrous
          C. Alternate materials
          D. Plastics
        III. Forming Processes
            A. Castings
            B. Forging
            C. Rolling
            D. Powder matallurgy
            E. Sheet metal
            F. Molding
          IV. Material Removal
              A. Traditional chip removal
                1. Lathe
                2. Mill
                3. Drill
                4. Grinder
                5. Broaching
              B. Nontraditional material removal
                1. Chemical milling
                2. EDM
                3. Laser drilling and cutting
                4. Other processes
            V. Joining and Assembly
                A. Adhesives
                B. Brazing
                C. Soldering
                D. Welding
                E. Mechanical fasteners
              VI. Finishing
                  A. Cleaning
                  B. Coating
                  C. Uncovering
                  D. Staining
                  E. Rearranging
                  F. Heat treating
                  G. Quality control
                VII. Techniques of Electronic Fabrication
                    A. Soldering techniques
                    B. Desoldering techniques
                    C. Wire wrapping techniques
                    D. Printed circuit board etching techniques
                    E. Electromechanical assembly and construction techniques
                    F. Chassis and motherboard assembly techniques
                    G. Interpreting the schematic to construct the physical equipment
                    H. Techniques of schematic tracing and wire busses
                  VIII. Identification and Recognition of Electronics Components and Circuits
                      A. Schematic symbols
                      B. Manufacturer's ratings and specifications
                      C. Physical aspects of devices in electronics
                      D. Physical aspects and specifications of common subsystems such as power supplies
                      E. Connectors, wire sizes and types, cable types and harnessing
                      F. Coding techniques used to label components and subsystems
                      G. Techniques of electronic drafting
                      H. Techniques of taping, layout, and reduction for computer boards
                    IX. Total Quality Control
                        A. Concepts of precision measurements
                        B. Concepts of total quality management
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